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Thermal conductivity of copper nanowires filled mesoporous silica


C. Huang1, Y. Feng1, X. Zhang1, D. Zhang1 and G. Wang2

1School of Mechanical Engineering, University of Science and Technology Beijing, P.R. China
2School of Materials Science and Engineering, University of Science and Technology Beijing, P.R. China

Keywords: mesoporous composite
property: effective thermal conductivity
material: nanowires; Cu/MCM-41; molecular dynamics

MCM-41 mesoporous silica consists of uniform hexagonal, unconnected cylindrical pores with diameters that can be tuned within the range 2-10 nm. MCM-41 has various potential applications in thermal materials with special thermal conductivity. MCM-41 with different pore sizes or porosity was prepared and it was further used as template to support Copper nanowires. Heterogenous mesoporous composites Cu/MCM-41 were synthesized, and their thermal properties were investigated numerically and experimentally. The synthesized composites were characterized by X-ray diffraction (XRD) and High Resolution Transmission Electron Microscopy (HRTEM). The Equilibrium Molecular Dynamics were performed to simulate the thermal conductivity of MCM-41 with Cu nanowires filled in the mesochannels. The meso-scale structural unit was established and small angle XRD simulation was carried out to validate this modeled structure by comparing with experimental XRD results. Based on one-dimensional heat transfer analysis, the mathematical expression for effective thermal conductivity of Cu/MCM-41 was obtained. Finally, the thermal conductivities of mesoporous silica MCM-41 and mesoporous composites Cu/MCM-41 were measured by hot-wire method respectively. The effects of pore sizes or porosity, nanowire size, filling ratio were further analyzed.

ACKNOWLEDGMENTS:

The work is supported by the National Natural Science Foundations of China (No.50836001).

References
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