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Thermal conductivity of three-component composites of core-shell particles with nanostructured shell layer


S. Kim1, S. Mun1, H. Choi2 and K. Lee2

1Center for High-Temperature Energy-Materials, Korea Institute of Science and Technology, Sungbuk-Gu, Seoul, Korea
2R&D Center of Donghyun Electronics Co., Ltd., Cheongbuk, Pyeongtaek-Si, Korea

Keywords: thermal conductivity; three-component composites; core-shell particles; particulate composites; mesopores
property: thermal conductivity; microstructural analysis; nanoporous structure; electromagnetic properties
material: alumina; three-phase composites; soft magnetic alloy

In the high-power light-emitting diodes display and multi-functional electronic devices, there are critical issues such as heat dissipation and electromagnetic interference which cause a program to malfunction or to health hazards[1,2]. To solve these issues, multi-component composites with high thermal performance have recently been studied by many researchers [3,4]. In this study, the thermal conductivity of three-component composites of core-shell particles with a nanostructured shell layer was investigated. Soft-magnetic FeCr core and alumina shell powders were fabricated by a supercritical fluid technology combined with sol-gel processing and subsequent heat treatment. As-prepared core-shell particles and additional alumina powders were blended with a polyolefin binder solution, and then were tape-casted onto the Mylar film. The three-component composite sheets consisting of the core-shell particles with a mesoporous γ-Al2O3 shell were obtained and the thermal conductivities were measured. The three-component composites showed much higher thermal conductivity compared to that of the simple mixture composites of the FeCr-alumina. The effect of the core-shell particles with the core-shell particles on thermal conductivity was theoretically calculated using a modified thermal conductivity theory. The higher thermal conductivity was discussed from the results of the theoretical calculation and microstructural analysis.

References
  1. F. Devis. F, Wong. C, I. Leong, International Symposium on Safety Science and Technology 4, 95, (2004)

  2. M.W. Kim, D.W. Kim, B.S. Koo, Y.B. Kim, O.S. Choi, N.D. Kim, 20th International Zurich Symposium on Electromagnetic Compatibility 2009, p. 213-216

  3. B. Nait-Ali, K. Haberko, H. Vesteghem, J. Absi, D.S. Smith, J. Euro. Ceram. Soc., 27, 1345 (2007)

  4. W. Palst, E. Gregorova, Ceramic International 32, 89 (2006)

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